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About
Capabilities
Applications
Why Outsource?
New Product Intro
Program Management
Materials & Capacity Planning
Quality Assurance & Test
Printed Circuit Boards & Assemblies
Fiber Optic Interconnect
Copper Interconnect
Higher Level Assemblies/Chassis
RoHS
Federal Electronics' SMT line is enclosed in an environmentally controlled room to insure maximum process control.
Our Capabilities - Printed Circuit Board Assemblies
Capabilities
0201 to 2 inch square components
12 mil pitch leaded devices
µBGA 20 mil pitch
Processes
RoHS
100% AOI on SMT components
Automatic vision correction for stencil printing
µBGA repair and replacement
X-ray inspection for BGA and QFN devices
Aqueous or no-clean solder process
DI closed-loop aqueous wash
Ionic contamination testing
Selective soldering
Conformal coating
Quick change over feeder exchange carts
Significant Equipment
Dek Horizon
Surface Mount Techniques Screen Printer
Philips/Assembleon Offline Vision Preparation Tool
Philips/Assembleon Topaz XiII
Philips/Assembleon Emerald XiII
Vitronics Soltec XPM2 Reflow Solder Oven (Lead Free Certified)
FocalSpot FSX080 80kv Xray Station
Denon RD500SH Semi-automated PCB rework station
Aqueous Technology Millenium II Inline Aqueous Cleaning System
Separation Technologists ST502 Closed-Loop Aqueous Batch Washer
Mirtec MV-7L In-Line AOI Machine
ICOM 5000 Ionic Contamination Tester