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Federal Electronics' SMT line is enclosed in an environmentally controlled room to insure maximum process control.

 
  Our Capabilities - Printed Circuit Board Assemblies  

Capabilities

  • 0201 to 2 inch square components
  • 12 mil pitch leaded devices
  • µBGA 20 mil pitch

Processes

  • RoHS
  • 100% AOI on SMT components
  • Automatic vision correction for stencil printing
  • µBGA repair and replacement
  • X-ray inspection for BGA and QFN devices
  • Aqueous or no-clean solder process
  • DI closed-loop aqueous wash
  • Ionic contamination testing
  • Selective soldering
  • Conformal coating
  • Quick change over feeder exchange carts

Significant Equipment

  • Dek Horizon
  • Surface Mount Techniques Screen Printer
  • Philips/Assembleon Offline Vision Preparation Tool
  • Philips/Assembleon Topaz XiII
  • Philips/Assembleon Emerald XiII
  • Vitronics Soltec XPM2 Reflow Solder Oven (Lead Free Certified)
  • FocalSpot FSX080 80kv Xray Station
  • Denon RD500SH Semi-automated PCB rework station
  • Aqueous Technology Millenium II Inline Aqueous Cleaning System
  • Separation Technologists ST502 Closed-Loop Aqueous Batch Washer
  • Mirtec MV-7L In-Line AOI Machine
  • ICOM 5000 Ionic Contamination Tester