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Federal Electronics’ multiple service capabilities result in reduction in higher level assembly costs by eliminating margin stack-up.

 
  Our Capabilities - Higher Level Assemblies (HLA’s)  

Federal Electronics’ mixed-technology printed circuit board, fiber optic interconnect and copper interconnect assemblies are typically offered as discrete services, but when bundled as a comprehensive integrated solution, result in significantly higher value to the customer. By offering multiple manufacturing services, we are able to reduce HLA costs by eliminating margin stack-up and reduce lead-times by maintaining control of a greater portion of the manufacturing process.

Assembly types include:

  • Fan trays
  • Industrial control panels
  • Power vaults
  • Drawer assemblies
  • Box level
  • Sub-system level
  • Frame level

Federal Electronics also has the technical expertise to develop functional test procedures that insure compliance to HLA performance specifications.